HT46R47 View Datasheet(PDF) - Unspecified
Part Name
Description
Manufacturer
HT46R47 Datasheet PDF : 45 Pages
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HT46R47
Pin Description
Pin No.
Pin Name
I/O
ROM Code
Option
Description
4~2
1
18
17
16, 15
PA0~PA2
PA3/PFD
PA4/TMR
PA5/INT
PA6, PA7
Bidirectional 8-bit input/output port. Each bit can be
configured as wake-up input by ROM code option.
Pull-high Software instructions determine the CMOS output or
I/O Wake-up Schmitt trigger input with or without pull-high resistor
PA3 or PFD (determined by pull-high options: bit option). The PFD,
TMR and INT are pin-shared with PA3, PA4 and PA5,
respectively.
Bidirectional 4-bit input/output port. Software in-
structions determine the CMOS output, Schmitt trig-
8
PB0/AN0
ger input with or without pull-high resistor
7
6
PB1/AN1
PB2/AN2
I/O
Pull-high
(determined by pull-high options: bit option) or A/D in-
put.
5
PB3/AN3
Once a PB line is selected as an A/D input (by using
software control), the I/O function and pull-high
resistor are disabled automatically.
9
VSS
¾
¾
Negative power supply, ground.
Bidirectional I/O line. Software instructions deter-
Pull-high mine the CMOS output, Schmitt trigger input with or
10
PD0/PWM I/O PD0 or without a pull-high resistor (determined by pull-high
PWM options: bit option). The PWM output function is
pin-shared with PD0 (dependent on PWM options).
11
RES
I
¾
Schmitt trigger reset input. Active low.
12
VDD
¾
¾
Positive power supply
13
OSC1
14
OSC2
OSC1, OSC2 are connected to an RC network or a
I Crystal Crystal (determined by ROM code option) for the in-
O
or RC ternal system clock. In the case of RC operation, OSC2
is the output terminal for 1/4 system clock.
Absolute Maximum Ratings
Supply Voltage ...............VSS-0.3V to VSS+5.5V
Input Voltage.................VSS-0.3V to VDD+0.3V
Storage Temperature ................-50°C to 125°C
Operating Temperature ..............-40°C to 85°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi-
mum Ratings² may cause substantial damage to the device. Functional operation of this device
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
Rev. 1.40
3
July 18, 2001
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