TDA8932T-T View Datasheet(PDF) - NXP Semiconductors.

Part Name

Description

Manufacturer

TDA8932T-T

Class-D audio amplifier

NXP Semiconductors. 

NXP Semiconductors

TDA8932

Class-D audio amplifier

REQ

=

-R----3----×-----Z----i

R3 + Zi

(9)

Where:

REQ = equivalent resistance [Ω]

R3 = parallel resistor [Ω]

Zi = internal input impedance

Example:

Substituting R1 = R2 = 4.7 kΩ, Zi = 100 kΩ and R3 = 22 kΩ in Equation 8 and Equation 9

results in a gain of Gv(tot) = 26.3 dB.

14.6 Device synchronization

If two or more TDA8932 devices are used in one application it is recommended that all

devices are synchronized running at the same switching frequency to avoid beat tones.

Synchronization can be realized by connecting all OSCIO pins together and configure one

of the TDA8932 devices as master, while the other TDA8932 devices are configured as

slaves (see Figure 10).

A device is configured as master by connecting a resistor between pins OSCREF and

VSSD(HW) setting the carrier frequency. Pin OSCIO of the master is then configured as an

oscillator output for synchronization. The OSCREF pins of the slave devices should be

shorted to VSSD(HW) configuring pin OSCIO as an input.

master

IC1

TDA8932

OSCREF OSCIO

slave

IC2

TDA8932

OSCIO OSCREF

Cosc

100 nF

Rosc

39 kΩ

VSSD

VSSD

Fig 10. Master slave concept in two chip application

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14.7 Thermal behavior (printed-circuit board considerations)

The heatsink in the application with the TDA8932 is made with the copper on the

Printed-Circuit Board (PCB). The TDA8932 uses the four corner leads (pins 1, 16, 17 and

32) for heat transfer from the die to the PCB. The thermal foldback will limit the maximum

junction temperature to 140 °C.

TDA8932_2

Preliminary data sheet

Rev. 02 — 12 December 2006

© NXP B.V. 2006. All rights reserved.

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