TDA8932T View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
TDA8932T Datasheet PDF : 45 Pages
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NXP Semiconductors
TDA8932
Class-D audio amplifier
22. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.4.1
8.4.2
8.4.3
8.4.4
8.4.5
8.5
8.6
8.7
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
14.6
14.7
14.8
14.9
14.10
14.11
15
15.1
16
17
17.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 6
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Mode selection and interfacing . . . . . . . . . . . . . 6
Pulse width modulation frequency . . . . . . . . . . 7
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal Foldback (TF) . . . . . . . . . . . . . . . . . . . 9
OverTemperature Protection (OTP) . . . . . . . . . 9
OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
Window Protection (WP). . . . . . . . . . . . . . . . . 10
Supply voltage protection . . . . . . . . . . . . . . . . 10
Diagnostic input and output . . . . . . . . . . . . . . 11
Differential inputs . . . . . . . . . . . . . . . . . . . . . . 11
Output voltage buffers. . . . . . . . . . . . . . . . . . . 12
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 13
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17
Thermal characteristics. . . . . . . . . . . . . . . . . . 17
Static characteristics. . . . . . . . . . . . . . . . . . . . 18
Dynamic characteristics . . . . . . . . . . . . . . . . . 20
Application information. . . . . . . . . . . . . . . . . . 23
Output power estimation. . . . . . . . . . . . . . . . . 23
Output current limiting. . . . . . . . . . . . . . . . . . . 25
Speaker configuration and impedance . . . . . . 25
Single-ended capacitor . . . . . . . . . . . . . . . . . . 25
Gain reduction . . . . . . . . . . . . . . . . . . . . . . . . 26
Device synchronization . . . . . . . . . . . . . . . . . . 27
Thermal behavior (printed-circuit board
considerations) . . . . . . . . . . . . . . . . . . . . . . . . 27
Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 29
SE curves measured in reference design. . . . 30
BTL curves measured in reference design . . . 32
Typical application schematics (simplified) . . . 35
Test information . . . . . . . . . . . . . . . . . . . . . . . . 38
Quality information . . . . . . . . . . . . . . . . . . . . . 38
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 39
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Introduction to soldering . . . . . . . . . . . . . . . . . 40
17.2
Wave and reflow soldering . . . . . . . . . . . . . . . 40
17.3
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 40
17.4
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 41
18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 42
19
Revision history . . . . . . . . . . . . . . . . . . . . . . . 43
20
Legal information . . . . . . . . . . . . . . . . . . . . . . 44
20.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 44
20.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
20.3
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 44
20.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 44
21
Contact information . . . . . . . . . . . . . . . . . . . . 44
22
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 December 2006
Document identifier: TDA8932_2
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