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STW20NM50 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STW20NM50
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STW20NM50 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
STW20NM50
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol
Parameter
Test Conditions
td(on)
tr
Turn-on Delay Time
Rise Time
VDD = 250V, ID = 10 A
RG = 4.7VGS = 10 V
(see test circuit, Figure 3)
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDD = 400 V, ID = 20 A,
VGS = 10 V
Qgd
Gate-Drain Charge
SWITCHING OFF
Symbol
Parameter
tr(Voff)
Off-voltage Rise Time
tf
Fall Time
tc
Cross-over Time
Test Conditions
VDD = 400 V, ID = 20 A,
RG = 4.7Ω, VGS = 10 V
(see test circuit, Figure 5)
Min. Typ. Max. Unit
24
ns
16
ns
40
56
nC
13
nC
19
nC
Min. Typ. Max. Unit
9
ns
8.5
ns
23
ns
SOURCE DRAIN DIODE
Symbol
Parameter
Test Conditions
ISD
Source-drain Current
ISDM (2) Source-drain Current (pulsed)
VSD (1) Forward On Voltage
ISD = 20 A, VGS = 0
trr
Reverse Recovery Time
ISD = 20 A, di/dt = 100 A/µs,
Qrr
Reverse Recovery Charge
VDD = 100 V, Tj = 25°C
Irrm
Reverse Recovery Current (see test circuit, Figure 5)
trr
Reverse Recovery Time
ISD = 20 A, di/dt = 100 A/µs,
Qrr
Reverse Recovery Charge
VDD = 100 V, Tj = 150°C
Irrm
Reverse Recovery Current (see test circuit, Figure 5)
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Min. Typ.
350
4.6
26
435
5.9
27
Safe Operating Area
Thermal Impedance
Max.
20
80
1.5
Unit
A
A
V
ns
µC
A
ns
µC
A
3/8

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