STPS2L60UF View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STPS2L60UF

Power Schottky rectifier

STMicroelectronics 

Package information

2

Package information

STPS2L60

● Epoxy meets UL94, V0

● Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Table 5.

E E1

SMB flat dimensions

A

D

L 2x

L

b

Dimensions

Ref. Millimeters

Inches

c

L2 2x

L1 2x

Min. Typ. Max. Min. Typ. Max.

A 0.90

1.10 0.035

0.043

b 1.95

2.20 0.077

0.087

c 0.15

0.40 0.006

0.016

D 3.30

3.95 0.130

0.156

E 5.10

5.60 0.200

0.220

E1 4.05

4.60 0.189

0.181

L 0.75

1.50 0.029

0.059

L1

0.40

0.016

L2

0.60

0.024

Figure 17. SMB flat footprint dimensions

5.84

(0.230)

2.07

(0.082)

1.20

(0.047)

3.44

1.20

(0.136) (0.047)

millimeters

(inches)

The footprint in Figure 17 has been optimized for the SMB flat package. The footprint of the

SMB package can be used instead.

6/9

Doc ID 9173 Rev 6

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