SSD1810 View Datasheet(PDF) - Solomon Systech
Part Name
Description
Manufacturer
SSD1810 Datasheet PDF : 34 Pages
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PIN ARRANGEMENT
FRS
FR
CL
VSS
IRS
VDD
MODE
VSS
/RES
VDD
P/S
VSS
/CS1
CS2
VDD
C68/80
VSS
D/C
R/W
VSS
E(/RD)
VDD
D0
D1
D2
D3
D4
D5
D6(SCK)
D7(SDA)
NC
NC
VSS
VSS
VEE
VEE
VEE
C3N
C3N
C3N
C1P
C1P
C1P
C1N
C1N
C1N
C2P
C2P
C2P
C2N
C2N
C2N
VL6
VF
VF
VDD
VL2
VL2
VL3
VL3
VL4
VL4
VL5
VL5
VL6
NC
NC
1
SSD1810A
Center : 9980, -3572
Radius : 27.3u
Center : 17291, -2879
Size : 99.75u x 99.75u
68
Center : -20585, 5745
197
Size 99.75u x 99.75u
SEG94
SEG93
SEG92
SEG91
SEG90
SEG89
SEG88
SEG87
SEG86
SEG85
SEG84
SEG83
SEG82
SEG81
SEG80
SEG79
SEG78
SEG77
SEG76
- MODE connect to VDD [34MUX MODE IS SET]
- MODE connect to N/C or VSS [32MUX MODE]
- IRS connect to VDD [Use Internal resistors network]
- IRS connect to N/C or VSS [Use external resistors network]
Note:
1. This diagram showing Die Face Up view.
2. Coordinates and Size of all alignment marks
are in unit um and w.r.t. center of the chip.
Die Size : 299.85 mil X 93.03 mil
Die Thickness : 21mil +/- 1mil
Bump Height: Nominal 18um
Tolerance <4um within die
<8um within lot
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
92
SEG7
Center : 20583,5619.5
Radius : 102.025u
SOLOMON
Figure 3 SSD1810A Gold Bump Die Pin Arrangement
REV 1.1
05/01
SSD1810/A
7
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