MCZ33390EF/R2 View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
MCZ33390EF/R2 Datasheet PDF : 15 Pages
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VBAT DC Supply Voltage (1)
Input I/O Pins (2)
BUS and LOAD Outputs
ESD Voltage (3)
Human Body Model
Machine Model
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow (4), (5)
VBAT
-0.3 to 40
V
VI/O(CPU)
-0.3 to 7.0
V
VBUS
-2.0 to 16
V
V
VESD1
VESD2
±2000
±200
TSTG
-65 to 150
°C
TA
-40 to 125
°C
TJ
-40 to 150
°C
TPPRT
Note 5.
°C
Thermal Resistance (Junction-to-Ambient)
RθJ-A
180
°C / W
Notes
1. An external series diode must be used to provide reverse battery protection of the device.
2. SLEEP, TX, RX, and 4X/LOOP are normally connected to a microcontroller.
3. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
33390
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
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