HUL7001 View Datasheet(PDF) - Panasonic Corporation
Part Name
Description
Manufacturer
HUL7001 Datasheet PDF : 6 Pages
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Hologram Unit
HUL7001
4. Important Information Regarding Soldering
Special plastics are used in the LDHU package
and hologram. Therefore only the leads (pins)
should be heated (during soldering iron, dip, etc.),
and soldering time should be short. Total heating
methods such as reflow soldering should be
avoided. (This device is gold-plated to ensure
good solder adhesion, so a short soldering time is
sufficient.) It is also recommended that a heat
sink or other means be used to improve the
package’s heat-releasing effects in order to pre-
vent the package from becoming hot as a result of
heat transfer and radiation even when the leads
are heated.
Soldering location
A
,,, A
,,, A : Make sure there is a gap of at least 1mm.
Soldering temperature and time
Temperature : 260˚C maximum
Time : 5 seconds maximum
5. Flux cleaning method
Alcohol is recommended as a solvent for flux clean-
ing. Chlorine base solvents in particular are a
cause of lead corrosion and device deterioration.
Petroleum base solvents should be avoided since
they deteriorate the adhesive between the holo-
gram and package.
In addition, ultrasonic cleaning should be avoided
since the device is hollow. Care should be taken
in brushing the hologram surface, as this may
scratch the back side.
6. Mechanical stress
(1) Pressure on the package
The LDHU package is made thin in order to re-
duce its size. Therefore, pressure on the package
resulting of heat release, etc. may cause problems
such as a change in the package shape or changes
to its characteristics. In the point pressure appli-
cation, force should be limited to 1kgf (9.8N) or
less, but please design so that the area pressure
application can be adopted as much as possible.
(2) Lead formation and cutting
In cases where lead formation and cutting are re-
quired, these actions must be performed at nor-
mal temperatures prior to soldering. Machining
steps performed at high temperatures immediately
after soldering, or after the solder has hardened
should be avoided. In addition, steps should be
taken to ensure that excessive mechanical stress
is not applied during lead formation and cutting.
Special care should be taken to avoid stress on
the lead bases of the package, as this may create
problems such as chipping the resin.
7. Other issues
(1) The surface of the hologram is very important for
light emission and light detecting. Therefore care
should be taken to ensure that there are no finger-
prints on the surface, residual flux after solder-
ing, or adhering dust.
(2) Viewing the laser beam with the naked eye is ex-
tremely dangerous and may result in blindness.
Do not look directly at the laser while it is operat-
ing.
(3) The products listed in this document are intended
for use in standard applications, i.e., general elec-
tronic devices (such as office equipment, measur-
ing equipment, and consumer electronics prod-
ucts). Customers considering applications involv-
ing special quality and reliability requirements and
carrying a risk of loss of human life or bodily dam-
age in the event of an accident or malfunction, or
specific applications (such as aerospace applica-
tions, transportation equipment, combustion
equipment, and safety devices), and customers
considering applications other than the standard
applications intended by us should contact our
sales office before using these products.
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