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IFX20001MBV50 View Datasheet(PDF) - Infineon Technologies

Part Name
Description
Manufacturer
IFX20001MBV50
Infineon
Infineon Technologies Infineon
IFX20001MBV50 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
IFX20001
General Product Characteristics
4.2
Functional Range
Pos.
Parameter
4.2.1
4.2.2
4.2.3
4.2.4
Input voltage
Input Voltage
Inhibit Voltage
Junction temperature
Symbol
VI
VI
VINH
Tj
Limit Values
Min.
Max.
4.0
45
5.5
45
-0.3
40
-40
125
Unit Remarks
V IFX20001MBV33
V IFX20001MBV50
V
°C –
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the Electrical Characteristics table.
4.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Pos. Parameter
Symbol
Limit Values
Unit Conditions
4.3.5
4.3.1
Junction to Ambient
RthJA
Min.
Typ.
81
217
Max.
K/W
K/W
2s2p board1)
Footprint only2)
4.3.2
117 –
K/W 300 mm2 PCB
heatsink area2)
4.3.3
103 –
K/W 600 mm2 PCB
heatsink area2)
4.3.4 Junction to Soldering Point
RthJSP
30
K/W Pins 2, 5 fixed to TA
1) Specified RthJA value is according to JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The product
(chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the package contacted the first inner copper layer.
2) Package mounted on PCB FR4; 80 x 80 x 1.5 mm; 35 µm Cu, 5 µm Sn; horizontal position; zero airflow.
Not subject to production test; specified by design.
Data Sheet
6
Rev. 1.1, 2013-01-08

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