LM75BIM-3 View Datasheet(PDF) - Maxim Integrated
Part Name
Description
Manufacturer
LM75BIM-3 Datasheet PDF : 12 Pages
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Digital Temperature Sensor and Thermal
Watchdog with 2-Wire Interface
ABSOLUTE MAXIMUM RATINGS (Note 1)
+VS to GND ...........................................................-0.3V to +6.0V
OS, SDA, SCL to GND...........................................-0.3V to +6.0V
All Other Pins to GND .................................-0.3V to (+VS + 0.3V)
Input Current at Any Pin (Note 2)..........................................5mA
Package Input Current (Note 2)..........................................20mA
OS Output Sink Current ......................................................10mA
Continuous Power Dissipation (TA = +70°C) (Note 3)
8-Pin µMAX (µSOP)
(derate 4.5mW/°C above +70°C) ..................................362mW
8-Pin SO (SOP) (derate 5.9mW/°C above +70°C) ........471mW
Junction-to-Case Thermal Resistance (θJC) (Note 3)
8-Pin µMAX (µSOP) .......................................................42°C/W
8-Pin SO (SOP)..............................................................40°C/W
Junction-to-Ambient Thermal Resistance (θJA) (Note 3)
8-Pin µMAX (µSOP) .....................................................221°C/W
8-Pin SO (SOP)............................................................170°C/W
ESD Protection
Human Body Model (RD = 1.5kΩ, CS = 100pF)
All Pins to GND .................................................................±2kV
Operating Temperature Range .........................-55°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifica-
tions do not apply when operating the device beyond its rated operating conditions.
Note 2: When the input voltage (VI) at any pin exceeds the Absolute Maximum limits (VI < GND, VI > 6V or VI > +VS), the current at
that pin should be limited to 5mA. The 20mA maximum package input current rating limits the number of pins that can safely
exceed the power supplies with an input current of 5mA to four.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a single-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(+VS = +3.0V to +5.5V, unless otherwise noted. Temperature accuracy specifications apply for +VS = 3.3V for versions with “-3” in
the suffix and for +VS = 5V for versions with “-5” in the suffix. TA = -55°C to +125°C, unless otherwise noted. Typical values are at
+VS = +5V, TA = +25°C.) (Notes 4, 5)
PARAMETER
Accuracy (6 σ)
Accuracy (3 σ) (Note 6)
Resolution
Temperature Conversion Time
Quiescent Supply Current
+VS Supply Voltage Range
OS Output Saturation Voltage
OS Delay
SYMBOL
CONDITIONS
-25°C ≤ TA ≤ +100°C
-55°C ≤ TA ≤ +125°C
-25°C ≤ TA ≤ +100°C
-55°C ≤ TA ≤ +125°C
(Note 7)
I2C inactive
Shutdown mode, +VS = 3V
Shutdown mode, +VS = 5V
IOUT = 4.0mA (Note 8)
(Note 9)
MIN TYP MAX UNITS
-2.0
+2.0
°C
-3.0
+3.0
-1.5
+1.5
°C
-2.0
+2.0
9
Bits
100
300
ms
0.25
0.5
mA
4
µA
6
3.0
5.5
V
0.8
V
1
6
Conver-
sions
OS Output Fall Time
TOS Default Temperature
THYST Default Temperature
tOF
CL = 400pF, IO = 3mA (Note 10)
(Note 11)
(Note 11)
250
ns
80
°C
75
°C
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