MAX5096 View Datasheet(PDF) - Maxim Integrated

Part Name

Description

Manufacturer

MAX5096

40V, 600mA Buck Converters with Low Quiescent-Current Linear Regulator Mode

Maxim Integrated 

MAX5096/MAX5097

40V, 600mA Buck Converters with Low-

Quiescent-Current Linear Regulator Mode

Absolute Maximum Ratings

(All voltages referenced to PGND, unless otherwise noted.)

IN (transient, 1ms)..................................................-0.3V to +45V

SGND....................................................................-0.3V to +0.3V

LX...................................................................-1V to (VIN + 0.3V)

LX Current................................................................................2A

EN...............................................................-0.3V to (VIN + 0.3V)

BP, SYNC, LDO/BUCK, RESET to SGND.............-0.3V to +12V

BP, RESET Output Current.................................................25mA

CT, SS, ADJ, COMP to SGND...................-0.3V to (VBP + 0.3V)

OUT........................................................................ -0.3V to +11V

OUT Short-Circuit Duration........................................Continuous

Continuous Power Dissipation (TA = +70°C)*

16-Pin TQFN (derate 33.3mW/°C above +70°C) ......2666mW

20-Pin TSSOP (derate 21.7mW/°C above +70°C) ....1739mW

Operating Temperature Range.......................... -40°C to +125°C

Junction Temperature.......................................................+150°C

Storage Temperature Range............................. -60°C to +150°C

Lead Temperature (soldering, 10s).................................. +300°C

*As per JEDEC 51 Standard—Multilayer Board.

Package Thermal Characteristics (Note 1)

TQFN

Junction-to-Ambient Thermal Resistance (θJA)..........30.0°C/W

Junction-to-Case Thermal Resistance (θJC)...................1.7°C/W

TSSOP

Junction-to-Ambient Thermal Resistance (θJA)..........46.0°C/W

Junction-to-Case Thermal Resistance (θJC)......................2°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics

(VIN = +14V, IOUT = 1mA, CIN = 100μF, COUT = 22μF, L = 22μH, CBP = 1μF, VEN = +2.4V, SGND = PGND = 0V, TA = TJ =

-40°C to +125°C, unless otherwise noted. Typical values are at TA = TJ = +25°C.) (Note 1)

PARAMETER

SYSTEM INPUT

Input Voltage Range (LDO Mode)

Input Voltage Range

(Buck Mode)

Internal Input Undervoltage

Lockout

Internal Input Undervoltage-

Lockout Hysteresis

BP (Internal Regulator) Output

Voltage

SYMBOL

CONDITIONS

VIN_LDO

VIN_BUCK

LDO/BUCK = high

LDO/BUCK = low

VUVLO VBP rising

VUVLO_HYS VBP rising

VBP

VIN = +4.5V, IBP = 100μA

MIN TYP MAX UNITS

4

40

V

5

40

V

3.5

3.65

3.9

V

0.2

V

3.75

4

4.20

V

Quiescent Supply Current

(LDO Mode)

Buck Converter No-Load Supply

Current

Shutdown Supply Current

IQ

IQ

IQ_BUCK

ISHDN

LDO/BUCK = high,

measured at input supply

return, VOUT = 5V,

IOUT = 100μA

LDO/BUCK = high,

measured at input supply

return, VOUT = 5V,

IOUT = 100mA

TA = -40°C

to +125°C

TA = -40°C

to +125°C

VIN = 14V, VOUT = 5V, IOUT = 0

VEN = 0V, measured from

VIN

TA = -40°C to

+125°C

TA = -40°C to

+125°C

38

70

µA

44

100

680

µA

6

19

µA

6

12

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