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APE3108 View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS

Part Name
Description
Manufacturer
APE3108 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
6.0 Bonding Diagram of APE0508 / APE1008
APExx08 Series
ROM
(0, 0)
PRB3 15
Y
1 PWM2/Cout
PRB2 14
2 Vdd1
PWM1
3
Pad Size : 80 um x 80 um
OSC 13
* The IC substrate must be connected to GND.
GND2 12
GND1
4
PRA0
5
PRA1
6
PRA2 PRA3 PRB0 PRB1
7
8
9
10
Vdd2
11
Pad #
1
2
3
4
5
6
7
8
Pad Name
PWM2/Cout
Vdd1
PWM1
GND1
PRA0
PRA1
PRA2
PRA3
X
-518
-518
-431
-283
-173
-63
47
157
X
Y
Pad # Pad Name
X
-195
9
PRB0
267
-479
10
PRB1
377
-603
11
Vdd2
487
-603
12
GND2
489
-574
13
OSC
489
-574
14
PRB2
489
-574
15
PRB3
489
-574
Y
-574
-574
-574
-414
-304
-194
-84
Chip Size :
APE0508 : 1234 um x 1404 um
APE1008 : 1234 um x 1404 um
5
Rev 1.3
2003/8/18

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