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APE1508 View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS

Part Name
Description
Manufacturer
APE1508 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
6.1 Bonding Diagram of other APExx08 series
APExx08 Series
ROM
Pad Size: 80 um x 80 um
Y
* The IC substrate must be connected to GND.
PRB3 15
1 PWM2/Cout
PRB2 14
OSC 13
(0, 0)
2 Vdd1
PWM1
3
GND2 12
GND1
4
PRA0
5
PRA1 PRA2
6
7
PRA3
8
PRB0
9
PRB1
10
Vdd2
11
X
Pad # Pad Name
X
1
PWM2/Cout
58
2
Vdd1
58
3
PWM1
145
4
GND1
293
5
PRA0
403
6
PRA1
513
7
PRA2
623
8
PRA3
733
Y
Pad # Pad Name
X
Y
466
9
PRB0
843
87
182
10
PRB1
953
87
58
11
Vdd2
1063
87
58
12
GND2
1059
247
87
13
OSC
1059
357
87
14
PRB2
1059
467
87
15
PRB3
1059
577
87
Chip Size :
APE1508 : 1230 um x 1848 um,
APE3108 : 1230 um x 1848 um,
APE5208 : 1230 um x 2528 um,
APE2008 : 1230 um x 1848 um
APE4108 : 1230 um x 2528 um
APE6308 : 1230 um x 2528 um
6
Rev 1.3
2003/8/18

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