MAX6900 View Datasheet(PDF) - Maxim Integrated

Part Name

Description

Manufacturer

MAX6900

I2C-Compatible RTC in a TDFN

Maxim Integrated 

I2C-Compatible RTC in a TDFN

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information

go to www.maxim-ic.com/packages.)

COMMON DIMENSIONS

SYMBOL

A

D

E

A1

L

k

A2

MIN. MAX.

0.70

0.80

2.90

3.10

2.90

3.10

0.00

0.05

0.20

0.40

0.25 MIN.

0.20 REF.

PACKAGE VARIATIONS

PKG. CODE

N

D2

T633-1

T833-1

6 1.50–0.10

8 1.50–0.10

T1033-1

10 1.50–0.10

E2

2.30–0.10

2.30–0.10

2.30–0.10

e

0.95 BSC

0.65 BSC

0.50 BSC

JEDEC SPEC

MO229 / WEEA

MO229 / WEEC

MO229 / WEED-3

b

[(N/2)-1] x e

0.40–0.05 1.90 REF

0.30–0.05 1.95 REF

0.25–0.05 2.00 REF

DALLAS

SEMICONDUCTOR

PROPRIETARY INFORMATION

TITLE:

PACKAGE OUTLINE, 6, 8 & 10L,

TDFN, EXPOSED PAD, 3x3x0.80 mm

APPROVAL

DOCUMENT CONTROL NO.

21-0137

REV.

2

D2

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are

implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 17

© 2003 Maxim Integrated Products

Printed USA

is a registered trademark of Maxim Integrated Products.

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