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MAX809HTRG(2010) View Datasheet(PDF) - ON Semiconductor

Part Name
Description
Manufacturer
MAX809HTRG Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
MAX809 Series, MAX810 Series
PIN DESCRIPTION
Pin No.
Symbol
1
GND
2
RESET (MAX809)
2
RESET (MAX810)
3
VCC
Description
Ground
RESET output remains low while VCC is below the reset voltage threshold, and for a reset timeout
period after VCC rises above reset threshold
RESET output remains high while VCC is below the reset voltage threshold, and for a reset timeout
period after VCC rises above reset threshold
Supply Voltage (Typ)
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply Voltage (VCC to GND)
RESET Output Voltage (CMOS)
Input Current, VCC
Output Current, RESET
VCC
0.3 to 6.0
V
0.3 to (VCC + 0.3)
V
20
mA
20
mA
dV/dt (VCC)
Thermal Resistance, JunctiontoAir (Note 1)
SOT23
SC70
RqJA
100
V/msec
301
°C/W
314
Operating Junction Temperature Range
TJ
40 to +105
°C
Storage Temperature Range
Tstg
65 to +150
°C
Lead Temperature (Soldering, 10 Seconds)
Tsol
+260
°C
ESD Protection
Human Body Model (HBM): Following Specification JESD22A114
Machine Model (MM): Following Specification JESD22A115
V
2000
200
Latchup Current Maximum Rating: Following Specification JESD78 Class II
ILatchup
mA
Positive
200
Negative
200
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This based on a 35x35x1.6mm FR4 PCB with 10mm2 of 1 oz copper traces under natural convention conditions and a single component
characterization.
2. The maximum package power dissipation limit must not be exceeded.
PD
+
TJ(max) *
RqJA
TA
with TJ(max) = 150°C
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