MAX809 View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
MAX809 Datasheet PDF : 11 Pages
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MAX809 Series,
MAX810 Series
Very Low Supply Current
3−Pin Microprocessor
Reset Monitors
The MAX809 and MAX810 are cost−effective system supervisor
circuits designed to monitor VCC in digital systems and provide a reset
signal to the host processor when necessary. No external components
are required.
The reset output is driven active within 10 msec of VCC falling
through the reset voltage threshold. Reset is maintained active for a
timeout period which is trimmed by the factory after VCC rises above
the reset threshold. The MAX810 has an active−high RESET output
while the MAX809 has an active−low RESET output. Both devices
are available in SOT−23 and SC−70 packages.
The MAX809/810 are optimized to reject fast transient glitches on
the VCC line. Low supply current of 0.5 mA (VCC = 3.2 V) makes these
devices suitable for battery powered applications.
Features
• Precision VCC Monitor for 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V, and 5.0 V
Supplies
• Precision Monitoring Voltages from 1.2 V to 4.9 V Available
in 100 mV Steps
• Four Guaranteed Minimum Power−On Reset Pulse Width Available
(1 ms, 20 ms, 100 ms, and 140 ms)
• RESET Output Guaranteed to VCC = 1.0 V.
• Low Supply Current
• Compatible with Hot Plug Applications
• VCC Transient Immunity
• No External Components
• Wide Operating Temperature: −40°C to 105°C
• Pb−Free Packages are Available
Typical Applications
• Computers
• Embedded Systems
• Battery Powered Equipment
• Critical Microprocessor Power Supply Monitoring
VCC
VCC
MAX809/810
RESET
RESET
VCC
PROCESSOR
RESET
INPUT
GND
GND
http://onsemi.com
3
1
2
SOT−23
(TO−236)
CASE 318
MARKING
DIAGRAM
3
xxx MG
G
1
2
SC−70
(SOT−323)
CASE 419
xx MG
G
1
xxx = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
GND 1
3 VCC
RESET 2
RESET
SOT−23/SC−70
(Top View)
NOTE: RESET is for MAX809
RESET is for MAX810
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
Figure 1. Typical Application Diagram
© Semiconductor Components Industries, LLC, 2007
1
February, 2007 − Rev. 15
Publication Order Number:
MAX809S/D
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