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FEDW9046BC-01 View Datasheet(PDF) - Oki Electric Industry

Part Name
Description
Manufacturer
FEDW9046BC-01
OKI
Oki Electric Industry OKI
FEDW9046BC-01 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
OKI Semiconductor
FEDW9046BC-01
MBF9046BC
RECOMMENDATION FOR SOLDER PAD PATTERN
The solder pad pattern should be designed by customers because it depends on the electrical
performance of the customers’ system. Following is an example of solder pad pattern which is used in
OKI’s package evaluation board. Please be noted that this is for reference purpose only.
25 µm
0.1 mm
25 µm
0.5 mm
0.1 mm
0.1 mm
PCB pad pattern
Metal mask pattern
Pad of Device
Please pay attention to the following items to maintain electrical performance.
(1) Metal mask pattern for cream solder should be 25 µm smaller on each side. Metal mask is 0.15 mm in
thickness.
(2) As the impedance of Tx, Rx, ANT is designed for 50, please consider this for the design of mother board.
9/11

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