Packaging
Freescale Semiconductor, Inc.
5 Packaging
PIN 1
INDEX AREA
A
5
0.1 C
2X
5
0.1 C
2X
M
G
B
EXPOSED DIE
ATTACH PAD
25
24
3.25
2.95
0.1 C A B
17
16
0.5
32X
0.3
M
0.1 C A B
3.25
2.95
32
1
DETAIL M
PIN 1 INDEX
0.25
VIEW M-M
0.5 28X
8
N
9
0.30
32X 0.18
0.1 M C A B
0.05 M C
(45 5)
(1.73)
1.0
1.00
0.8
0.75
0.05
0.00
0.1 C
0.05 C
5
(0.25)
(0.5)
DETAIL G
C
SEATING PLANE
VIEW ROTATED 90° CLOCKWISE
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. THE COMPLETE JEDEC DESIGNATOR FOR THIS
PACKAGE IS: HF-PQFP-N.
4. CORNER CHAMFER MAY NOT BE PRESENT.
DIMENSIONS OF OPTIONAL FEATURES ARE FOR
REFERENCE ONLY.
5. COPLANARITY APPLIES TO LEADS, CORNER
LEADS, AND DIE ATTACH PAD.
6. FOR ANVIL SINGULATED QFN PACKAGES,
MAXIMUM DRAFT ANGLE IS 12°.
0.217
0.137
0.217
0.137
(0.25)
(0.1)
DETAIL S
PREFERRED BACKSIDE PIN 1 INDEX
DETAIL S
0.60
0.24
0.065
32X 0.015
(0.25)
DETAIL N
PREFERRED CORNER CONFIGURATION
4
DETAIL T
0.60
0.24
DETAIL N
CORNER CONFIGURATION OPTION
4
0.475
0.425
1.6
BACKSIDE
1.5
PIN 1 INDEX
DETAIL M
PREFERRED BACKSIDE PIN 1 INDEX
(90 )
2X
0.39
0.31
DETAIL M
BACKSIDE PIN 1 INDEX OPTION
0.25
R
0.15
DETAIL M
BACKSIDE PIN 1 INDEX OPTION
0.1
2X 0.0
DETAIL T
BACKSIDE PIN 1 INDEX OPTION
Figure 7. Outline Dimensions for QFN-32, 5x5 mm
(Case 1311-03, Issue E)
14
MC13190 Advance Information
MOTOROLA
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