SA56004AD(2013) View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
SA56004AD
(Rev.:2013)
(Rev.:2013)
NXP Semiconductors.
SA56004AD Datasheet PDF : 43 Pages
| |||
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
19. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
Functional description . . . . . . . . . . . . . . . . . . . 6
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.8.1
7.8.2
7.8.3
7.8.4
7.8.5
7.8.6
7.8.7
7.8.8
7.8.9
7.8.10
7.9
7.9.1
7.9.1.1
7.9.1.2
7.9.1.3
7.9.2
7.9.3
7.9.4
7.9.5
7.10
7.10.1
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 6
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Register overview . . . . . . . . . . . . . . . . . . . . . . . 7
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8
Starting conversion . . . . . . . . . . . . . . . . . . . . . . 9
Low power software standby mode . . . . . . . . . 9
Temperature data format . . . . . . . . . . . . . . . . . 9
SA56004X SMBus registers . . . . . . . . . . . . . . 10
Command register . . . . . . . . . . . . . . . . . . . . . 10
Local and remote temperature registers
(LTHB, LTLB, RTHB, RTLB) . . . . . . . . . . . . . . 10
Configuration register (CON) . . . . . . . . . . . . . 10
Status register (SR) . . . . . . . . . . . . . . . . . . . . 11
Conversion rate register (CR). . . . . . . . . . . . . 12
Temperature limit registers . . . . . . . . . . . . . . . 12
Programmable offset register (remote only) . . 13
ALERT mode register (AM) . . . . . . . . . . . . . . 13
Other registers . . . . . . . . . . . . . . . . . . . . . . . . 13
One-shot register . . . . . . . . . . . . . . . . . . . . . . 13
Interruption logic and functional description . . 14
ALERT output . . . . . . . . . . . . . . . . . . . . . . . . . 14
ALERT output in comparator mode . . . . . . . . 14
ALERT output in interrupt mode . . . . . . . . . . . 14
ALERT output in SMBus ALERT mode . . . . . 15
T_CRIT output . . . . . . . . . . . . . . . . . . . . . . . . 17
Fault Queue . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Temperature measurement . . . . . . . . . . . . . . 19
Diode fault detection . . . . . . . . . . . . . . . . . . . . 19
SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 20
Serial interface reset. . . . . . . . . . . . . . . . . . . . 22
8
Application design-in information . . . . . . . . . 22
8.1
8.1.1
8.1.2
8.1.3
8.2
Factors affecting accuracy . . . . . . . . . . . . . . . 22
Remote sensing diode . . . . . . . . . . . . . . . . . . 22
Thermal inertia and self-heating . . . . . . . . . . . 23
Layout considerations. . . . . . . . . . . . . . . . . . . 24
Power sequencing considerations . . . . . . . . . 25
8.2.1
8.2.2
8.3
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
17
17.1
17.2
17.3
17.4
18
19
Power supply slew rate . . . . . . . . . . . . . . . . . 25
Application circuit . . . . . . . . . . . . . . . . . . . . . . 25
Timing and firmware consideration . . . . . . . . 25
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 26
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27
Performance curves . . . . . . . . . . . . . . . . . . . . 30
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 32
Soldering of SMD packages . . . . . . . . . . . . . . 35
Introduction to soldering. . . . . . . . . . . . . . . . . 35
Wave and reflow soldering. . . . . . . . . . . . . . . 35
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 35
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 36
Soldering: PCB footprints . . . . . . . . . . . . . . . 37
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 40
Revision history . . . . . . . . . . . . . . . . . . . . . . . 40
Legal information . . . . . . . . . . . . . . . . . . . . . . 41
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 41
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Contact information . . . . . . . . . . . . . . . . . . . . 42
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 25 February 2013
Document identifier: SA56004X
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