T2526(2003) View Datasheet(PDF) - Atmel Corporation
Part Name
Description
Manufacturer
T2526 Datasheet PDF : 12 Pages
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T2526
Ordering Information
Delivery: unsawn wafers (DDW) in box, SO8 (150 mil) and TSSOP8 (3 mm body).
Extended Type
Number
T2526N0xx(1)-yyy(5)
T2526N1xx(1)-DDW
PL(2)
2
1
RPU(3)
30
30
D(4)
2179
2179
Type
Standard type: ³ 10 pulses, enhanced sensibility, high data rate
T2526N2xx(1)-yyy(5)
2
40
1404 Lamp type: ³ 10 pulses, enhanced suppression of disturbances, secure
T2526N3xx(1)-DDW
1
40
1404 data transmission
T2526N6xx(1)-yyy(5)
2
30
3415
Short burst type: ³ 6 pulses, enhanced data rate
T2526N7xx(1)-DDW
1
30
3415
Notes:
1. xx means the used carrier frequency value f0 30, 33, 36, 38, 40, 44 or 56 kHz (76 kHz type on request)
2. Two pad layout versions (see Figure 14 and Figure 15) available for different assembly demand
3. Integrated pull-up resistor at pin OUT (see electrical characteristics)
4. Typical data transmission rate up to bit/s with f0 = 56 kHz, VS = 5 V (see Figure 10 on page 8)
5. yyy means kind of packaging:
.................... .......DDW -> unsawn wafers in box
.................... .......6AQ -> (only on request, TSSOP8 taped and reeled)
Pad Layout
Figure 14. Pad Layout 1 (DDW only)
GND
IN
OUT
T2526
VS
FUSING
Figure 15. Pad Layout 2 (DDW, SO8 or TSSOP8)
(6) GND (5) IN
(1)
VS
T2526
(3)OUT
FUSING
11
4597C–AUTO–11/03
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