T2526S0XXC-DDW(2009) View Datasheet(PDF) - Atmel Corporation

Part Name

Description

Manufacturer

T2526S0XXC-DDW
(Rev.:2009)

Low-voltage IR Receiver ASSP

Atmel Corporation 

8. Chip Dimensions

Figure 8-1. Chip Size in µm

GND

336,906

IN

783,887

VS

55,652

T2526

T2526

1210, 1040

scribe

55,62

OUT

0,0

Fusing

width

Note: Pad coordinates are given for lower left corner of the pad in µm from the origin 0,0

Dimensions

Pad metallurgy

Finish

Length inclusive scribe

Width inclusive scribe

Thickness

Pads

Fusing pads

Material

Thickness

Material

Thickness

1.16 mm

1.37 mm

290 µ ± 5%

90 µ × 90 µ

70 µ × 70 µ

AlCu/AlSiTi(1)

0.8 µm

Si3N4/SiO2

0.7/0.3 µm

Note: 1. Value depends on manufacture location.

11

4597H–AUTO–09/09

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