TEMT6000X01 View Datasheet(PDF) - Vishay Semiconductors
Part Name
Description
Manufacturer
TEMT6000X01 Datasheet PDF : 6 Pages
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TEMT6000X01
Vishay Semiconductors
Ambient Light Sensor
REFLOW SOLDER PROFILE
300
250
255 °C
240 °C
217 °C
200
150
max. 120 s
100
max. 260 °C
245 °C
max. 30 s
max. 100 s
50 max. ramp up 3 °C/s max. ramp down 6 °C/s
0
0
50 100 150 200 250 300
19841
Time (s)
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
PACKAGE DIMENSIONS in millimeters
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 3
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %.
18464
www.vishay.com
492
For technical questions, contact: detectortechsupport@vishay.com
Document Number: 81579
Rev. 1.8, 26-Mar-09
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