VNQ810M(2013) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

VNQ810M
(Rev.:2013)

Quad channel high side driver

STMicroelectronics 

Electrical specifications

VNQ810M

2.2

Thermal data

Table 4.

Symbol

Thermal data (per island)

Parameter

Value

Unit

Rthj-lead

Rthj-amb

Thermal resistance junction-lead

Thermal resistance junction-ambient

(one chip ON)

20

60(1)

44(2)

°C/W

°C/W

Thermal resistance junction-ambient

Rthj-amb (two chips ON)

46(1)

31(2)

°C/W

1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35 µm thick) connected

to all VCC pins. Horizontal mounting and no artificial air flow.

) 2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 µm thick) connected to

t(s all VCC pins. Horizontal mounting and no artificial air flow.

2.3 Electrical characteristics roduc Values specified in this section are for 8V < VCC < 36V; -40°C < Tj < 150°C, unless

P otherwise stated.

lete Figure 3. Current and voltage conventions

bso IS3,4

O VCC3,4

- IIN1

t(s) VIN1

ISTAT1

VSTAT1

IIN2

c VIN2

ISTAT2

duVSTAT2

IIN3

ro VIN3

ISTAT3

P VSTAT3 IIN4

VIN4 ISTAT4

Obsolete VSTAT4

VCC3,4 VCC1,2

IS1,2

VF1 (*)

VCC1,2

INPUT1

STATUS1

INPUT2

STATUS2

INPUT3

STATUS3

INPUT4

STATUS4

GND3,4

OUTPUT1

OUTPUT2

OUTPUT3

OUTPUT4

GND1,2

IOUT1

IOUT2

VOUT1

IOUT3

VOUT2

IOUT4 VOUT3

VOUT4

IGND3,4

IGND1,2

Note:

VFn = VCCn - VOUTn during reverse battery condition.

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