LPC1767 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
LPC1767 Datasheet PDF : 79 Pages
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NXP Semiconductors
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
D
BA
ball A1
index area
A2
E
A
A1
detail X
SOT926-1
e1
e
1/2 e b
∅v M C A B
∅w M C
K
J
H
G
F
E
D
C
B
A
ball A1
index area
1 2 3 4 5 6 7 8 9 10
e
e2
1/2 e
y1 C
C
y
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
A2
b
D
E
e
e1 e2
v
w
y
y1
mm
1.2
0.4 0.8 0.5
0.3 0.65 0.4
9.1
8.9
9.1
8.9
0.8
7.2
7.2 0.15 0.05 0.08 0.1
OUTLINE
VERSION
IEC
SOT926-1
---
REFERENCES
JEDEC
JEITA
---
---
EUROPEAN
PROJECTION
ISSUE DATE
05-12-09
05-12-22
Fig 38. Package outline SOT926-1 (TFBGA100)
LPC1769_68_67_66_65_64_63
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 5 April 2011
© NXP B.V. 2011. All rights reserved.
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