7WBD3305 View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
7WBD3305 Datasheet PDF : 13 Pages
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7WBD3305
PACKAGE DIMENSIONS
UQFN8, 1.6x1.6, 0.5P
CASE 523AN−01
ISSUE O
D
A
ÉÉ PIN ONE
REFERENCE
ÉÉ 2X
ÉÉ 0.10 C
B
E
2X
0.10 C
TOP VIEW
0.05 C
DETAIL B (A3)
0.05 C
SIDE VIEW
A1
8X L
3
8X
L3
e
5
EXPOSED Cu
ÇÉÇÉ
MOLD CMPD
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A1
A
C
SEATING
PLANE
DETAIL B
OPTIONAL
CONSTRUCTION
L1
L3
b
(0.10)
(0.15)
MILLIMETERS
DIM MIN MAX
A 0.45 0.60
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.60 BSC
E 1.60 BSC
e 0.50 BSC
L 0.35 0.45
L1 −−− 0.15
L3 0.25 0.35
DETAIL A
OPTIONAL
CONSTRUCTION
SOLDERING FOOTPRINT*
1.70
0.50
PITCH
1
1
DETAIL A
7
8
8X b
0.10 C A B
BOTTOM VIEW
0.05 C NOTE 3
0.35
1.70
7X 0.25
8X
0.53
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
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