CF1156 View Datasheet(PDF) - Nippon Precision Circuits
Part Name
Description
Manufacturer
CF1156 Datasheet PDF : 8 Pages
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CF1156 series
PAD LAYOUT and COORDINATES
(Unit: µm)
VDD LO BO
3
2
1
TC 4
(1230,1230)
T2 5
T1 6
11 VSS
7
8
9
10
(0,0) VSS TO OSH LH
Chip size: 1.23 × 1.23mm
Chip thickness: 300 ± 30µm
T1, T2, TC, and TO bonding is not required.
Number
1
2
3
4
5
6
7
8
9
10
11
Pad dimensions (Unit: µm)
Pad
X
Y
BO
930
1075
LO
529
1075
VDD
155
1075
TC
155
887
T2
155
608
T1
155
420
VSS
223
155
TO
486
155
OSH
750
155
LH
1041
155
VSS
1075
420
PAD DESCRIPTION
Name
OSH, LH
LO
BO
VDD
VSS
T1, T2, TC
TO
Function
Melody mode control inputs. Built-in pull-down resistors mean LOW-level signals are obtained when inputs are open circuit. The
resistance of the pull-down resistor varies with the applied voltage, as described in the Electrical Characteristics.
LED drive output, HIGH level during non-play mode.
Piezoelectric speaker driver output. LOW level output during non-play mode and during musical rest notes. HIGH level output
during gaps between melody notes.
Supply. The rear surface of the chip is VDD level.
Ground
Test inputs. Pull-down resistor built-in.
Test output. The oscillator frequency (typ. 50kHz) is output for monitoring purposes.
SEIKO NPC CORPORATION —2
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