HB28E016BP2 View Datasheet(PDF) - Hitachi -> Renesas Electronics

Part Name

Description

Manufacturer

HB28E016BP2

Mobile Embedded Flash with MultiMediaCard™ Interface 16 Mbyte/32 Mbyte

Hitachi -> Renesas Electronics 

Physical Outline (HB28D032BP2)

0.20 S B

10.00

INDEX

4× 0.15

0.20 S

S

0.10 S

HB28E016/D032BP2

Unit: mm

B

0.80

2.20

12

11

10

9

8

A

7

6

5

A

4

3

2

1

HGF EDCBA

71 × φ0.45 ± 0.05

φ0.08 M S A B

Details of the part A

Datum A, B are defined as center lines of ball matrix.

Sn-Ag-Cu alloy were used for ball material.

Hitachi Code

JEDEC Code

EIAJ Code

Mass (reference value)

BP-71V

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—

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89

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