MAC7100 View Datasheet(PDF) - Motorola => Freescale

Part Name

Description

Manufacturer

MAC7100

MAC7100 Microcontroller Family Hardware Specifications

Motorola => Freescale 

Freescale Semiconductor, Inc.

Electrical Characteristics

3.5.1 Power Dissipation Simulation Details

Table 7. Thermal Resistance for 100 lead 14x14 mm LQFP, 0.5 mm Pitch 1

Rating

Junction to Ambient (Natural Convection)

Junction to Ambient (Natural Convection)

Junction to Ambient (@ 200 ft./min.)

Junction to Ambient (@ 200 ft./min.)

Junction to Board

Junction to Case

Junction to Package Top

1 100 LQFP, Case Outline: 983–02

Single layer board (1s)

Four layer board (2s2p)

Single layer board (1s)

Four layer board (2s2p)

Natural Convection

RθJA

RθJMA

RθJMA

RθJMA

RθJB

RθJC

ΨJT

Value

44

34

37

29

18

7

2

Unit

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Comments

1, 2

1, 3

1, 3

1, 3

4

5

6

Table 8. Thermal Resistance for 112 lead 20x20 mm LQFP, 0.65 mm Pitch 1

Rating

Junction to Ambient (Natural Convection)

Junction to Ambient (Natural Convection)

Junction to Ambient (@ 200 ft./min.)

Junction to Ambient (@ 200 ft./min.)

Junction to Board

Junction to Case

Junction to Package Top

1 112 LQFP, Case Outline: 987–01

Single layer board (1s)

Four layer board (2s2p)

Single layer board (1s)

Four layer board (2s2p)

Natural Convection

RθJA

RθJMA

RθJMA

RθJMA

RθJB

RθJC

ΨJT

Value

42

34

35

30

22

7

2

Unit

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Comments

1, 2

1, 3

1, 3

1, 3

4

5

6

Table 9. Thermal Resistance for 144 lead 20x20 mm LQFP, 0.5 mm Pitch 1

Rating

Junction to Ambient (Natural Convection)

Junction to Ambient (Natural Convection)

Junction to Ambient (@ 200 ft./min.)

Junction to Ambient (@ 200 ft./min.)

Junction to Board

Junction to Case

Junction to Package Top

1 144 LQFP, Case Outline: 918–03

Single layer board (1s)

Four layer board (2s2p)

Single layer board (1s)

Four layer board (2s2p)

Natural Convection

RθJA

RθJMA

RθJMA

RθJMA

RθJB

RθJC

ΨJT

Value

42

34

35

30

22

7

2

Unit

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Comments

1, 2

1, 3

1, 3

1, 3

4

5

6

Table 10. Thermal Resistance for 208 lead 17x17 mm MAP, 1.0 mm Pitch 1

Rating

Junction to Ambient (Natural Convection)

Junction to Ambient (Natural Convection)

Junction to Ambient (@ 200 ft./min.)

Junction to Ambient (@ 200 ft./min.)

Junction to Board

Junction to Case

Junction to Package Top

1 208 MAP BGA, Case Outline: 1159A-01

Single layer board (1s)

Four layer board (2s2p)

Single layer board (1s)

Four layer board (2s2p)

Natural Convection

RθJA

RθJMA

RθJMA

RθJMA

RθJB

RθJC

ΨJT

Value

46

29

38

26

19

7

2

Unit

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Comments

1, 2

1, 3

1, 3

1, 3

4

5

6

Comments:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top

surface of the board at the center lead. For fused lead packages, the adjacent lead is used.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC

JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

MOTOROLA

MAC7100 Microcontroller Family Hardware Specifications

7

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

For More Information On This Product,

Go to: www.freescale.com

Share Link: