PMXB56EN(2013) View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
PMXB56EN Datasheet PDF : 15 Pages
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NXP Semiconductors
PMXB56EN
30 V, N-channel Trench MOSFET
12. Package outline
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads;
3 terminals; body: 1.1 x 1.0 x 0.37 mm
SOT1215
visible depend upon
used manufacturing
technology (2x)
solderable lead
end, protrusion
max. 0.02 mm (3x)
D
pin 1
index area
visible depend upon
used manufacturing
technology (4x)
e
b (2x)
1
2
L (2x)
E
e1
E1
L1
3
A1
b1
A
D1
Dimensions (mm are the original dimensions)
0
1 mm
scale
Unit
A A1 b b1 D D1 E E1 e e1 L L1
min 0.34
0.22 0.245 1.05 0.87 0.95 0.16
0.17 0.195
mm nom 0.37
0.25 0.275 1.10 0.90 1.00 0.19 0.75 0.1 0.20 0.225
max 0.40 0.04 0.30 0.325 1.15 0.95 1.05 0.24
0.25 0.275
Note
1. Dimension A is including plating thickness.
Outline
version
References
IEC
JEDEC
JEITA
SOT1215
Fig. 19. Package outline DFN1010D-3 (SOT1215)
PMXB56EN
Product data sheet
All information provided in this document is subject to legal disclaimers.
25 September 2013
European
projection
sot1215_po
Issue date
13-03-05
13-03-06
© NXP N.V. 2013. All rights reserved
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