STA333ML13TR(2007) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STA333ML13TR
(Rev.:2007)
(Rev.:2007)
STMicroelectronics
STA333ML13TR Datasheet PDF : 15 Pages
| |||
STA333ML
7
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 8. PowerSSO36 exposed pad mechanical data and package dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.15
2.47 0.084
0.097
A2 2.15
2.40 0.084
0.094
a1
0
0.075 0
0.003
b 0.18
0.36 0.007
0.014
c 0.23
0.32 0.009
0.012
D (1) 10.10
10.50 0.398
0.413
E (1) 7.4
7.6 0.291
0.299
e
0.5
0.019
e3
8.5
0.335
F
2.3
0.090
G
0.10
0.004
G1
0.06
0.002
H 10.10
10.50 0.398
0.413
h
0.40
0.016
k
5˚
5˚
L 0.55
0.90 0.022
0.035
M
4.3
0.169
N
10˚
10˚
O
1.2
0.047
Q
0.8
0.031
S
2.9
0.114
T
3.65
0.144
U
1.0
0.039
X
4.1
4.7 0.161
0.185
Y
6.5
7.3 0.256
0.287
(1) "D” and “E" do not include mold flash or protrusions Mold flash
or protrusions shall not exceed 0.15 mm per side(0.006”)
OUTLINE AND
MECHANICAL DATA
PowerSSO-36
(exposed pad)
G
LEAD COPLANARITY
A
D
e
T
O
U
B
0.1 M A B
b
e3
hx45
Y
L
BOTTOM VIEW
7587131 A
13/15
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