SA58670BS(2007) View Datasheet(PDF) - NXP Semiconductors.

Part Name

Description

Manufacturer

SA58670BS
(Rev.:2007)

2.1 W/channel stereo Class D audio amplifier

NXP Semiconductors. 

NXP Semiconductors

SA58670

2.1 W/channel stereo Class D audio amplifier

11.6 Additional thermal information

The SA58670 HVQFN20 package incorporates an exposed die attach paddle (DAP) that

is designed to solder mount directly to the PCB heat spreader. By the use of thermal vias,

the DAP may be soldered directly to a ground plane or special heat sinking layer designed

into the PCB. The thickness and area of the heat spreader may be maximized to optimize

heat transfer and achieve lowest package thermal resistance.

SA58670_1

Objective data sheet

Rev. 01 — 22 June 2007

© NXP B.V. 2007. All rights reserved.

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