VND810MSP-E View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
VND810MSP-E Datasheet PDF : 20 Pages
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VND810MSP-E
Figure 3. Configuration Diagram (Top View) & Suggested Connections for Unused and N.C. Pins
GROUND
6
5
INPUT 1
7
4
STATUS 1
8
3
STATUS 2
9
2
INPUT 2
10
1
11
VCC
OUTPUT 1
OUTPUT 1
N.C.
OUTPUT 2
OUTPUT 2
Connection / Pin Status
Floating
X
To Ground
N.C.
X
X
Output
Input
X
X
Through 10KΩ resistor
Figure 4. Current and Voltage Conventions
IIN1
VIN1
ISTAT1
VSTAT1 IIN2
VIN2 ISTAT2
VSTAT2
INPUT 1
STATUS 1
INPUT 2
VCC
OUTPUT 1
STATUS 2
OUTPUT 2
GND
IGND
IS
VF1 (*) VCC
IOUT1
IOUT2 VOUT1
VOUT2
(*) VFn = VCCn - VOUTn during reverse battery condition
Table 4. Thermal Data
Symbol
Rthj-case
Rthj-amb
Parameter
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Value
2.4
52.4 (1)
37 (2)
Unit
°C/W
°C/W
Note: 1. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35µm thick). Horizontal mounting and no artificial
air flow.
Note: 2. When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35µm thick). Horizontal mounting and no artificial
air flow.
3/20
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