AD5421 View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

AD5421

16-Bit, Serial Input, Loop-Powered, 4 mA to 20 mA DAC

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. Transient currents of up

to 100 mA do not cause SCR latch-up.

Table 6.

Parameter

REGIN to COM

REGOUT to COM

Digital Inputs to COM,

RANGE0, RANGE1, RINT/REXT,

ALARM_CURRENT_DIRECTION,

REG_SEL0, REG_SEL1, REG_SEL2

Digital Inputs to COM

SCLK, SDIN, SYNC, LDAC

Digital Outputs to COM,

SDO, FAULT

REFIN to COM

REFOUT1, REFOUT2

VLOOP to COM

LOOP− to COM

DVDD to COM

IODVDD to COM

REXT1, CIN to COM

REXT2 to COM

DRIVE to COM

Operating Temperature Range (TA)

Industrial

Storage Temperature Range

Junction Temperature (TJ MAX)

Power Dissipation

Lead Temperature,

Soldering (10 sec)

ESD

Human Body Model

Field Induced Charged Device

Model

Machine Model

Rating

−0.3 V to +60 V

−0.3 V to +14 V

−0.3 V to DVDD + 0.3 V

or +7 V (whichever is less)

−0.3 V to IODVDD + 0.3 V

or +7 V (whichever is less)

−0.3 V to IODVDD + 0.3 V

or +7 V (whichever is less)

−0.3 V to +7 V

−0.3 V to +4.7 V

−0.3 V to +60 V

−5 V to +0.3 V

−0.3 V to +7 V

−0.3 V to +7 V

−0.3 V to +4.3 V

−0.3 V to +0.3 V

−0.3 V to +11 V

−40°C to +105°C

−65°C to +150°C

125°C

(TJ MAX − TA)/θJA

JEDEC Industry Standard

J-STD-020

3 kV

2 kV

200 V

AD5421

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 7. Thermal Resistance

Package Type

θJA1

θJC

28-Lead TSSOP_EP (RE-28-2)

32

9

32-Lead LFCSP_WQ (CP-32-11) 40

7

Unit

°C/W

°C/W

1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test

board with thermal vias. See JEDEC JESD51.

ESD CAUTION

Rev. H | Page 11 of 36

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