2SK2980
Absolute Maximum Ratings
Item
Symbol
Ratings
Drain to source voltage
VDSS
30
Gate to source voltage
VGSS
+12
–10
Drain current
Drain peak current
Channel dissipation
ID
1.0
ID(pulse)Note1
4
Pch Note2
0.8
Channel temperature
Tch
150
Storage temperature
Tstg
–55 to +150
Notes: 1. PW ≤ 10µs, duty cycle ≤ 1 %
2. Value at when using alumina ceramic board (12.5 x 20 x 0.7 mm)
(Ta = 25°C)
Unit
V
V
V
A
A
W
°C
°C
Electrical Characteristics
(Ta = 25°C)
Item
Symbol Min
Typ
Max Unit
Test Conditions
Drain to source breakdown voltage V(BR)DSS 30
Gate to source breakdown voltage V(BR)GSS +12
–10
Zero gate voltage drain current
IDSS
—
Gate to source leak current
IGSS
—
Gate to source cutoff voltage
VGS(off)
0.5
Static drain to source on state
resistance
RDS(on)
—
Static drain to source on state
resistance
RDS(on)
—
Forward transfer admittance
|yfs|
1.2
Input capacitance
Ciss
—
Output capacitance
Coss
—
—
—
—
—
—
—
—
1.0
—
±5.0
—
1.5
0.2
0.28
0.3
0.5
2.0
—
155
—
75
—
V ID = 100 µA, VGS = 0
V IG = +100 µA, VDS = 0
V IG = –100 µA, VDS = 0
µA VDS = 30 V, VGS = 0
µA VGS = ±8 V, VDS = 0
V ID = 10 µA, VDS = 5 V
Ω ID = 500 mA, VGS = 4 V Note3
Ω ID = 500 mA, VGS = 2.5 V Note3
S ID = 500 mA, VDS = 10 V Note3
pF VDS = 10 V, VGS = 0,
pF f = 1 MHz
Reverse transfer capacitance
Crss
—
35
—
pF
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Note: 3. Pulse test
td(on)
—
12
—
ns VGS = 4 V, ID = 500 mA,
tr
—
30
—
ns RL = 20 Ω
td(off)
—
35
—
ns
tf
—
30
—
ns
Rev.4.00 Sep 07, 2005 page 2 of 6