LPC1110FD20 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
LPC1110FD20 Datasheet PDF : 59 Pages
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NXP Semiconductors
LPC1111/12/13/14
32-bit ARM Cortex-M0 microcontroller
Serial interfaces:
UART with fractional baud rate generation, internal FIFO, and RS-485 support.
Two SPI controllers with SSP features and with FIFO and multi-protocol
capabilities (second SPI on LQFP48 and PLCC44 packages only).
I2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a
data rate of 1 Mbit/s with multiple address recognition and monitor mode.
Clock generation:
12 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used
as a system clock.
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz.
PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the system oscillator or the internal RC
oscillator.
Clock output function with divider that can reflect the system oscillator clock, IRC
clock, CPU clock, and the Watchdog clock.
Power control:
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, and Deep power-down modes.
Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
Processor wake-up from Deep-sleep mode via a dedicated start logic using up to
13 of the functional pins.
Power-On Reset (POR).
Brownout detect with four separate thresholds for interrupt and forced reset.
Unique device serial number for identification.
Single 3.3 V power supply (1.8 V to 3.6 V).
Available as 48-pin LQFP package, 33-pin HVQFN package, and 44-pin PLCC
package.
3. Applications
eMetering
Alarm systems
Lighting
White goods
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
LPC1111FHN33/101
HVQFN33
LPC1111FHN33/201
HVQFN33
LPC1112FHN33/101
HVQFN33
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
Version
n/a
n/a
n/a
LPC1111_12_13_14_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 16 April 2010
© NXP B.V. 2010. All rights reserved.
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