APE6316 View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS
Part Name
Description
Manufacturer
APE6316 Datasheet PDF : 8 Pages
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6.0 Bonding Diagram of APE1016 /APE1516 /APE2016
APExx16 Series
GND1 25
ROM
PRD0 24
PRD1 23
PRD2 22
PRD3 21
PRC0 20
1 Vdd3
Chip Size : 1432 um x 1650 um
Pad Size : 80 um x 80 um
* The IC substrate must be connected to GND.
PRC1 19
PRC2 18
PRC3 17
Y
2 PWM2/Cout
PRB0 16
OSC1 15
3 Vdd2
PWM1 GND3 PRA3 PRA2
6
7
4
5
PRA1 PRA0
8
9
PRB3 PRB2
10
11
GND2 14
PRB1 Vdd1
12
13
(0,0)
Pad #
1
2
3
4
5
6
7
8
9
10
11
12
13
Pad Name
Vdd3
PWM2/Cout
Vdd2
PWM1
GND3
PRA3
PRA2
PRA1
PRA0
PRB3/Reset
PRB2
PRB1/IR
Vdd1
X
56
58
58
145
293
413
533
653
773
893
1013
1133
1253
X
Y
Pad #
647
14
466
15
182
16
58
17
58
18
87
19
87
20
87
21
87
22
87
23
87
24
87
25
87
Pad Name
GND2
OSC1
PRB0/OSC2
PRC3
PRC2
PRC1
PRC0
PRD3
PRD2
PRD1
PRD0
GND1
X
1261
1261
1261
1261
1261
1261
1261
1261
1261
1261
1261
1261
Y
235
350
465
580
695
810
925
1040
1155
1270
1385
1500
5
Rev 1.1
2003/9/2
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