HMMC-5027 View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
Manufacturer
HMMC-5027 Datasheet PDF : 6 Pages
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VDD
Aux.
Drain
RF
Input
RF
Output
VG2
Chip ID No.
VG1
Aux. Gate
700
770 465
(±10 µm)
220
0
70
(VDD and Aux Drain Pads)
2910
(RF Output Pad)
555
285
75
70 (RF Input Pad)
Figure 2. HMMC-5027 Bonding Pad Locations.
1.5 mil dia.Gold Wire
Bond to ≥15 nF
DC Feedthru
4 nH Inductor
(1.0 mil Gold Wire Bond
with length of 200 mils)
2980 (± 10 µm)
2290
2580 2900
(VG2 Pad)
Notes:
All dimensions in microns.
Rectangular Pad Dim: 75 x 75 µm.
Octagonal Pad Dim: 90 µm dia.
All other dimensions ±5 µm (unless otherwise noted).
Chip thickness: 127 ± 15 µm.
≥68 pF Capacitor
Input and Output Thin Film
Circuit with ≥8 pF
DC Blocking Capacitor
Trace Offset
168 µm
(6.6 mils)
Gold Plated Shim
2.0 mil
nom. gap
VDD
IN
OUT
VG1
2.0 mil
nom. gap
0.7 mil dia. Gold Bond Wire
(Length NOT important)
Trace Offset
168 µm
(6.6 mils)
Bonding Island
1.5 mil dia.Gold Wire
Bond to ≥15 nF DC Feedthru
Figure 3. HMMC-5027 Assembly Diagram.
Note:
Total offset between RF input and RF
output pad is 335 µm (13.2 mils).
6-50
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