232261554223 View Datasheet(PDF) - Vishay Semiconductors
Part Name
Description
Manufacturer
232261554223 Datasheet PDF : 11 Pages
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2322 615 5....
Surface Mount, NTC Thermistors Vishay BCcomponents
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with “IEC 60286-3”. Basic dimensions are given below . Carrier tape material is paper.
PAPER TAPE
T
P0
D0
P2
E1
F
W
Cumulative pitch error: 0.2 mm over 10 pitches.
Cumulative tolerance over 10 holes: ±0.2 mm.
B0
A0
P1
JWB288
PAPER TAPE DIMENSIONS in millimeters
PARAMETER
A0; note 1
B0; note 1
W
E1
F
D0
P0; note 2
P1
P2
T tape thickness
T1 cover tape
Notes
1. Measured 0.3 mm above base pocket.
2. P0 pitch tolerance over any 10 pitches is ±0.2 mm.
LEADER/TRAILER TAPE SPECIFICATION
trailer end
Leader/trailer tape.
T1
DIMENSION
1.7
2.35
8.0
1.75
3.5
1.55
4.0
4.0
2.0
1.1
<0.1
TOLERANCE
±0.2
±0.1
±0.2
±0.1
±0.05
±0.05
±0.1
±0.1
±0.05
max
−
leader end
empty compartments
with cover tape
(min. 240 mm)
cover tape only
trailer (min. 160 mm)
leader ≥400 mm
TAPING PACKAGE REQUIREMENTS
Component is free and not sticking to top and/or bottom tape.
Component should be easy to remove from carrier tape.
TESTS AND REQUIREMENTS
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
6
TEST
METHOD
Tc
TEST
solderability
resistance to soldering heat
PROCEDURE
2 s at 235 °C
10 s at 260 °C
Document Number: 29044
Revision: 10-Oct-03
For technical questions contact: nlr.europe@vishay.com
CCB838
REQUIREMENTS
min. 95% of surface wetted
∆R/R < 5%
www.vishay.com
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