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APL1565A View Datasheet(PDF) - Anpec Electronics

Part Name
Description
Manufacturer
APL1565A Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
APL1565A
Application Information (Cont.)
Operating Region and Power Dissi-
pation
The thermal resistance of the case to circuit board,
and the rate of air flow all control the APL1565A’s
maximum power dissipation. The power dissipation
across the device is PD = IOUT (VIN-VOUT) and the maxi-
mum power dissipation is:
PDMAX = (TJ-TA) / (? JC + ? CA)
where T -T is the temperature difference between
JA
the junction and ambient air, ? JC is the thermal re-
sistance of the package, and ? CA is the thermal re-
sistance through the printed circuit board, copper
traces, and other materials to the ambient air.
The GND pin of the APL1565A provide an electrical
connection to ground and channeling heat away. If
power dissipation is large, connect the GND pin to
ground using a large pad or ground plane, can im-
prove the problem of over heat of IC.
Copyright ANPEC Electronics Corp.
5
Rev. A.3 - Oct., 2002
www.anpec.com.tw

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