5000 View Datasheet(PDF) - Intel

Part Name

Description

Manufacturer

5000

Dual-Core Intel® Xeon® Processor

Intel 

Introduction

1.1

Terminology

A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in

the asserted state when driven to a low level. For example, when RESET# is low, a

reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has

occurred. In the case of signals where the name does not imply an active state but

describes part of a binary sequence (such as address or data), the ‘#’ symbol implies

that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and

D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).

Commonly used terms are explained here for clarification:

• Dual-Core Intel® Xeon® Processor 5000 Series – Processor in the FC-LGA6

package with two physical processor cores. Dual-Core Intel Xeon processor 5000

series refers to the “Full Power” Dual-Core Intel Xeon Processor 5000 series with

1066 MHz Front Side Bus. For this document, “processor” is used as the generic

term for the “Dual-Core Intel® Xeon® Processor 5000 series”.

• Dual-Core Intel® Xeon® Processor 5063 (MV) – This is a lower power version

of the Dual-Core Intel Xeon Processor 5000 series. Dual-Core Intel Xeon Processor

5063 (MV) refers to the “Mid Power” Dual-Core Intel Xeon Processor 5000 series.

Unless otherwise noted, the terms “Dual-Core Intel Xeon 5000 series” and

“processor” also refer to the “Dual-Core Intel Xeon Processor 5063”.

• FC-LGA6 (Flip Chip Land Grid Array) Package – The Dual-Core Intel Xeon

Processor 5000 series package is a Land Grid Array, consisting of a processor core

mounted on a pinless substrate with 771 lands, and includes an integrated heat

spreader (IHS).

• FSB (Front Side Bus) – The electrical interface that connects the processor to the

chipset. Also referred to as the processor front side bus or the front side bus. All

memory and I/O transactions as well as interrupt messages pass between the

processor and chipset over the FSB.

• Functional Operation – Refers to the normal operating conditions in which all

processor specifications, including DC, AC, FSB, signal quality, mechanical and

thermal are satisfied.

• Storage Conditions – Refers to a non-operational state. The processor may be

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or

exposed to free air. Under these conditions, processor lands should not be

connected to any supply voltages, have any I/Os biased or receive any clocks.

Upon exposure to “free air” (that is, unsealed packaging or a device removed from

packaging material) the processor must be handled in accordance with moisture

sensitivity labeling (MSL) as indicated on the packaging material.

• Priority Agent – The priority agent is the host bridge to the processor and is

typically known as the chipset.

• Symmetric Agent – A symmetric agent is a processor which shares the same I/O

subsystem and memory array, and runs the same operating system as another

processor in a system. Systems using symmetric agents are known as Symmetric

Multiprocessing (SMP) systems.

• Integrated Heat Spreader (IHS) – A component of the processor package used

to enhance the thermal performance of the package. Component thermal solutions

interface with the processor at the IHS surface.

• Enhanced Intel SpeedStep Technology – The next generation implementation

of Intel SpeedStep technology which extends power management capabilities of

servers and workstations.

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

11

Share Link: