56F8357 View Datasheet(PDF) - Motorola => Freescale
Part Name
Description
Manufacturer
56F8357 Datasheet PDF : 160 Pages
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Freescale Semiconductor, Inc.
56F8357 Data Sheet Table of Contents
Part 1: Overview . . . . . . . . . . . . . . . . . . . . 4
1.1. 56F8357 Features . . . . . . . . . . . . . . . . . . 4
1.2. 56F8357 Description . . . . . . . . . . . . . . . . 5
1.3. Award-Winning Development
Environment . . . . . . . . . . . . . . . 6
1.4. Architecture Block Diagram . . . . . . . . . . . 7
1.5. Product Documentation . . . . . . . . . . . . . 10
1.6. Data Sheet Conventions . . . . . . . . . . . . 11
Part 2: Signal/Connection Descriptions 12
2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . 12
2.2. 56F8357 Signal Pins . . . . . . . . . . . . . . . 14
Part 3: On-Chip Clock Synthesis (OCCS) 32
3.1. Introduction . . . . . . . . . . . . . . . . . . . . . . 32
3.2. External Clock Operation . . . . . . . . . . . 33
3.3. Registers . . . . . . . . . . . . . . . . . . . . . . . . 34
Part 4: Memory Operating Modes (MEM) 35
4.1. Introduction . . . . . . . . . . . . . . . . . . . . . . 35
4.2. Program Map . . . . . . . . . . . . . . . . . . . . 36
4.3. Interrupt Vector Table . . . . . . . . . . . . . . 37
4.4. Data Map . . . . . . . . . . . . . . . . . . . . . . . . 40
4.5. Flash Memory Map . . . . . . . . . . . . . . . . 40
4.6. EOnCE Memory Map . . . . . . . . . . . . . . 42
4.7. Peripheral Memory Mapped Registers . 42
4.8. Factory Programmed Memory . . . . . . . . 68
Part 5: Interrupt Controller (ITCN) . . . . . 69
5.1. Introduction . . . . . . . . . . . . . . . . . . . . . . 69
5.2. Features . . . . . . . . . . . . . . . . . . . . . . . . 69
5.3. Functional Description . . . . . . . . . . . . . . 69
5.4. Block Diagram . . . . . . . . . . . . . . . . . . . . 71
5.5. Operating Modes . . . . . . . . . . . . . . . . . . 71
5.6. Register Descriptions . . . . . . . . . . . . . . 72
5.7. Resets . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Part 6: System Integration Module (SIM) 97
6.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . 97
6.2. Features . . . . . . . . . . . . . . . . . . . . . . . . 97
6.3. Operating Modes . . . . . . . . . . . . . . . . . . 98
6.4. Operation Mode Register . . . . . . . . . . . 98
6.5. Register Descriptions . . . . . . . . . . . . . . 99
6.6. Clock Generation Overview . . . . . . . . 111
6.7. Power Down Modes Overview . . . . . . 112
6.8. Stop and Wait Mode Disable Function 112
6.9. Resets . . . . . . . . . . . . . . . . . . . . . . . . . 113
Part 8: General Purpose Input/Output
(GPIO) . . . . . . . . . . . . . . . . . . . . . 118
8.1. Introduction . . . . . . . . . . . . . . . . . . . . . 118
8.2. Configuration . . . . . . . . . . . . . . . . . . . . 118
8.3. Memory Maps . . . . . . . . . . . . . . . . . . . 122
Part 9: Joint Test Action Group (JTAG) 122
9.1. 56F8357 Information . . . . . . . . . . . . . . 122
Part 10: Specifications . . . . . . . . . . . . . 122
10.1. General Characteristics . . . . . . . . . . . 122
10.2. DC Electrical Characteristics . . . . . . . 126
10.3. Temperature Sense . . . . . . . . . . . . . . 129
10.4. AC Electrical Characteristics . . . . . . . 129
10.5. Flash Memory Characteristics . . . . . . 130
10.6. External Clock Operation Timing . . . . 131
10.7. Phase Locked Loop Timing . . . . . . . . 131
10.8. Crystal Oscillator Timing . . . . . . . . . . 132
10.9. External Memory Interface Timing . . . 132
10.10. Reset, Stop, Wait, Mode Select,
and Interrupt Timing . . . . . . . 135
10.11. Serial Peripheral Interface (SPI)
Timing . . . . . . . . . . . . . . . . . . 137
10.12. Quad Timer Timing . . . . . . . . . . . . . 141
10.13. Quadrature Decoder Timing . . . . . . . 141
10.14. Serial Communication Interface
(SCI) Timing . . . . . . . . . . . . . 142
10.15. Controller Area Network (CAN)
Timing . . . . . . . . . . . . . . . . . . 143
10.16. JTAG Timing . . . . . . . . . . . . . . . . . . 143
10.17. Analog-to-Digital Converter (ADC)
Parameters . . . . . . . . . . . . . . 145
10.18. Equivalent Circuit for ADC Inputs . . . 147
10.19. Power Consumption . . . . . . . . . . . . . 147
Part 11: Packaging . . . . . . . . . . . . . . . . 149
11.1. Package and Pin-Out Information
56F8357 . . . . . . . . . . . . . . . . 149
Part 12: Design Considerations . . . . . . 153
12.1. Thermal Design Considerations . . . . . 153
12.2. Electrical Design Considerations . . . . 154
12.3. Power Distribution and I/O Ring
Implementation 155
Part 13: Ordering Information . . . . . . . 156
Part 7: Security Features . . . . . . . . . . . 114
7.1. Operation with Security Enabled . . . . . 114
7.2. Flash Access Blocking Mechanisms . . 114
Please see http://www.motorola.com/semiconductors for the most current Data Sheet revision.
56F8357 Technical Data
3
Preliminary
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