56F802 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

56F802

16-bit Digital Signal Controllers

Freescale Semiconductor 

General Characteristics

Table 3-2 Recommended Operating Conditions

Characteristic

ADC reference voltage1

Ambient operating temperature

1. VREF must be 0.3V below VDDA.

Symbol

Min

Typ

Max

Unit

VREF

2.7

TA

–40

–

VDDA

V

–

85

°C

Table 3-3 Thermal Characteristics6

Characteristic

Comments

Symbol

Value

32-pin LQFP

Unit

Note

s

Junction to ambient

Natural convection

Junction to ambient (@1m/sec)

Junction to ambient

Natural convection

Four layer board (2s2p)

Junction to ambient (@1m/sec) Four layer board (2s2p)

Junction to case

Junction to center of case

I/O pin power dissipation

Power dissipation

Junction to center of case

RθJA

50.2

°C/W 2

RθJMA

47.1

°C/W 2

RθJMA

(2s2p)

38.7

°C/W 1,2

RθJMA

37.4

°C/W 1,2

RθJC

17.8

°C/W 3

ΨJT

3.07

°C/W 4

P I/O

User Determined

W

PD

P D = (IDD x VDD + P I/O)

W

PDMAX

(TJ - TA) /RθJA

W

7

Notes:

1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.

Determined on 2s2p thermal test board.

2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC

specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on

a thermal test board with two internal planes (2s2p where s is the number of signal layers and p is the number

of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with the

non-single layer boards is Theta-JMA.

3. Junction to case thermal resistance, Theta-JC (RθJC), was simulated to be equivalent to the measured values

using the cold plate technique with the cold plate temperature used as the "case" temperature. The basic cold

plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal

metric to use to calculate thermal performance when the package is being used with a heat sink.

4. Thermal Characterization Parameter, Psi-JT (ΨJT), is the "resistance" from junction to reference point

thermocouple on top center of case as defined in JESD51-2. ΨJT is a useful value to use to estimate junction

temperature in steady state customer environments.

56F802 Technical Data, Rev. 9

Freescale Semiconductor

15

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