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BYD31 View Datasheet(PDF) - Philips Electronics

Part Name
Description
Manufacturer
BYD31 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Philips Semiconductors
Fast soft-recovery
controlled avalanche rectifiers
Product specification
BYD31 series
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE UNIT
Rth j-tp
Rth j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
lead length = 10 mm
note 1
180
K/W
250
K/W
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm, see Fig.11.
For more information please refer to the “General Part of associated Handbook”.
1996 Sep 18
4
Not recommended for new designs

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