74AHC2G241 View Datasheet(PDF) - Philips Electronics
Part Name
Description
Manufacturer
74AHC2G241 Datasheet PDF : 19 Pages
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Philips Semiconductors
74AHC2G241; 74AHCT2G241
Dual buffer/line driver; 3-state
Table 1: Quick reference data …continued
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns.
Symbol Parameter
Conditions
Min Typ Max Unit
Type 74AHCT2G241
tPHL, tPLH
tPZH, tPZL
propagation delay nA to nY
enable time1OE to 1Y
enable time 2OE to 2Y
tPHZ, tPLZ disable time1OE to 1Y
disable time 2OE to 2Y
CI
input capacitance
CPD
power dissipation
capacitance
CL = 15 pF; VCC = 5 V
-
CL = 15 pF; VCC = 5 V
-
CL = 15 pF; VCC = 5 V
-
CL = 15 pF; VCC = 5 V
-
CL = 15 pF; VCC = 5 V
-
-
CL = 50 pF; f = 1 MHz [1] [2] -
3.4 5.5 ns
3.9 5.1 ns
3.4 5.6 ns
4.5 6.8 ns
4.0 6.8 ns
1.5 10 pF
10 -
pF
[1] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
∑(CL × VCC2 × fo) = sum of outputs.
[2] The condition is VI = GND to VCC.
4. Ordering information
Table 2: Ordering information
Type number
Package
Temperature range Name
74AHC2G241DP −40 °C to +125 °C TSSOP8
74AHCT2G241DP −40 °C to +125 °C TSSOP8
74AHC2G241DC −40 °C to +125 °C VSSOP8
74AHCT2G241DC −40 °C to +125 °C VSSOP8
Description
Version
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
5. Marking
Table 3: Marking
Type number
74AHC2G241DP
74AHCT2G241DP
74AHC2G241DC
74AHCT2G241DC
Marking code
A241
C241
A41
C41
9397 750 12887
Product data sheet
Rev. 01 — 10 March 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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