UPD784216AYGF-XXX-3BA View Datasheet(PDF) - NEC => Renesas Technology

Part Name

Description

Manufacturer

UPD784216AYGF-XXX-3BA

16-BIT SINGLE-CHIP MICROCONTROLLERS

NEC => Renesas Technology 

µPD784214A, 784215A, 784216A, 784217A, 784218A, 784214AY, 784215AY, 784216AY, 784217AY, 784218AY

Table 15-1. Surface Mounting Type Soldering Conditions (2/2)

(2) µPD784214AGF-×××-3BA:100-pin plastic QFP(14 × 20 mm)

µPD784215AGF-×××-3BA:100-pin plastic QFP(14 × 20 mm)

µPD784216AGF-×××-3BA:100-pin plastic QFP(14 × 20 mm)

µPD784217AGF-×××-3BA: 100-pin plastic QFP (14 × 20 mm)

µPD784218AGF-×××-3BA: 100-pin plastic QFP (14 × 20 mm)

µPD784214AYGF-×××-3BA:100-pin plastic QFP(14 × 20 mm)

µPD784215AYGF-×××-3BA:100-pin plastic QFP(14 × 20 mm)

µPD784216AYGF-×××-3BA:100-pin plastic QFP(14 × 20 mm)

µPD784217AYGF-×××-3BA: 100-pin plastic QFP (14 × 20 mm)

µPD784218AYGF-×××-3BA: 100-pin plastic QFP (14 × 20 mm)

Soldering Method

Infrared reflow

VPS

Wave soldering

Partial heating

Soldering Conditions

Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

Count: Two times or less

Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),

Count: Two times or less

Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,

Preheating temperature: 120°C max. (package surface temperature)

Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)

Recommended

Condition Symbol

IR35-00-2

VP15-00-2

WS60-00-1

−

Caution Do not use different soldering methods together (except for partial heating).

Data Sheet U14121EJ2V0DS00

91

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