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S83C198 View Datasheet(PDF) - Intel

Part Name
Description
Manufacturer
S83C198 Datasheet PDF : 19 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
8XC198
PACKAGING
The 8XC198 is available in a 52-pin PLCC package and an 80-pin QFP package Contact your local sales
office to determine the exact ordering code for the part desired
Package Designators
N e 52-pin PLCC
S e 80-pin QFP
Thermal Characteristics
Package Type
PLCC
ija
40 C W
QFP
70 C W
ijc
4C W
All thermal impedance data is approximate for static air conditions at 1W of power dissipation Values will
change depending on operating conditions and application See the Intel Packaging Handbook (Order Number
240800) for a description of Intel’s thermal impedance test methodology
272034 – 2
Figure 4 52-Pin PLCC Package
NOTE
The above pinout diagram applies to the OTP (87C198) device The OTP device uses all of the programming pins shown
above The ROM (83C198) device only uses programming pins AINC PALE PMODE n and PROG The ROMless (80C198)
doesn’t use any of the programming pins
3

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