ACPF-7002 View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
Manufacturer
ACPF-7002 Datasheet PDF : 8 Pages
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0.60 ± 0.15
1
1.25 MAX
0.35 ± 0.15
8X
2
4
3
2.0
Shaded Region Grounded
Pin 1
Marking
: Pin 1 Location
A : Work Week
B,C,D : Lot Number
Figure 10. Detailed Bottom, Side and Top view of Package
Note:
Dimensions in mm
Layer 1
0.61
0.70
0.61
0.30
4
OUT
3
IN
1
2
Via to layer 2
0.33 1.92
This region is Soldermask covering ground
Region (4) & (2) is exposed ground for soldering filter pads
Note:
Dimensions in mm
Figure 11. Suggested PCB layers, viewed from top
Layer 2 (GROUND layer)
0.3
Metal voided
To decrease
0.3
Capacitance at
Input Port
0.3
Metal voided
To decrease
Capacitance at
output Port
5
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