CHA5390 View Datasheet(PDF) - United Monolithic Semiconductors
Part Name
Description
Manufacturer
CHA5390 Datasheet PDF : 8 Pages
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24-30GHz Medium Power Amplifier
Chip Assembly and Mechanical Data
CHA5390
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Ref. : CHA53901012 - 12-Jan.-01
Bonding pad positions
6/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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