AD9146(Rev0) View Datasheet(PDF) - Analog Devices
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Description
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AD9146 Datasheet PDF : 52 Pages
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ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD33 to AVSS, EPAD, CVSS
DVDD18, CVDD18 to AVSS, EPAD,
CVSS
AVSS to EPAD, CVSS
EPAD to AVSS, CVSS
CVSS to AVSS, EPAD
FSADJ, REFIO, IOUT1P, IOUT1N,
IOUT2P, IOUT2N to AVSS
D[7:0]P, D[7:0]N, FRAMEP, FRAMEN,
DCIP, DCIN to EPAD
DACCLKP, DACCLKN, REFCLKP,
REFCLKN to EPAD
RESET, IRQ, CS, SCLK, SDIO to EPAD
Junction Temperature
Storage Temperature Range
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−0.3 V to DVDD18 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to DVDD18 + 0.3 V
125°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD9146
THERMAL RESISTANCE
The exposed pad (EPAD) of the 48-lead LFCSP must be soldered
to the ground plane (AVSS). The EPAD provides an electrical,
thermal, and mechanical connection to the board.
Typical θJA, θJB, and θJC values are specified for a 4-layer board and
an 8-layer board in still air. Airflow increases heat dissipation,
effectively reducing θJA and θJB.
Table 7. Thermal Resistance
Package1
PCB
θJA
θJB
θJC
Unit
48-Lead LFCSP
4-layer 23.2 8.5 8.7 °C/W
48-Lead LFCSP
8-layer 16.4 3.9 7.1 °C/W
1 EPAD soldered to ground plane.
ESD CAUTION
Rev. 0 | Page 7 of 52
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