DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

ADN2850(RevB) View Datasheet(PDF) - Analog Devices

Part Name
Description
Manufacturer
ADN2850 Datasheet PDF : 20 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –7 V
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VB, VW to GND . . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
IB, IW
Intermittent2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .± 20 mA
Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 2 mA
Digital Inputs and Output Voltage
to GND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Operating Temperature Range3 . . . . . . . . . . . –40°C to +85°C
Maximum Junction Temperature (TJ MAX) . . . . . . . . . 150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature, Soldering4
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215؇C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220؇C
ADN2850
Thermal Resistance Junction-to-Ambient θJA,
LFCSP-16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35°C/W
TSSOP-16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C/W
Thermal Resistance Junction-to-Case θJC,
TSSOP-16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28°C/W
Package Power Dissipation = (TJ MAX – TA)/θJA
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating; functional operation of the device
at these or any other conditions above those listed in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2Maximum terminal current is bounded by the maximum current handling of the
switches, maximum power dissipation of the package, and maximum applied
voltage across any two of the B and W terminals at a given resistance.
3Includes programming of nonvolatile memory.
4Applicable to TSSOP-16 only. For LFCSP-16, please consult factory for details.
ORDERING GUIDE
Model
RWB_FS RDNL RINL Temperature Package
Package
(k) (LSB) (LSB) Range (°C) Description Option
Ordering
Quantity Top Mark*
ADN2850BCP25
25
ADN2850BCP25-RL7
25
ADN2850BCP250
250
ADN2850BCP250-RL7 250
ADN2850BRU25
25
ADN2850BRU25-RL7 25
±2
±4
–40 to +85 LFCSP-16 CP-16
±2
±4
–40 to +85 LFCSP-16 CP-16
7" Reel
±2
±4
–40 to +85 LFCSP-16 CP-16
±2
±4
–40 to +85 LFCSP-16 CP-16
7" Reel
±2
±4
–40 to +85 TSSOP-16 RU-16
±2
±4
–40 to +85 TSSOP-16 RU-16
7" Reel
96
1,000
96
1,000
96
1,000
BCP25
BCP25
BCP250
BCP250
2850B25
2850B25
*Line 1 contains product number, ADN2850, line 2 Top Mark branding contains differentiating detail by part type, line 3 contains lot number, line 4 contains product
date code YYWW.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADN2850 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. B
–5–

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]